2022年4月20日，香港大学李连忠教授应邀来温，在温州大学教工之家作了题为“Low-Dimensional Materials for Future Electronics ”的讲座。报告由温州大学新材料与产业技术研究院副院长张礼杰主持，金辉乐、陈锡安、邹超、袁一斐等教授及相关师生代表参加了本次讲座。首先我院副院长张礼杰对李连忠教授的到来表示热烈欢迎，并向师生介绍了李连忠教授基本情况。

讲座中，李连忠教授介绍了集成电路现存在的发展瓶颈，并围绕低维材料在未来电子器件中的应用展开阐述，简要概括了现今攻关工作的最新进展，以及未来电子学方向的应用前景。李连忠教授的学术报告内容丰富，讲座反应热烈，参会人员热情高涨，理论与实际的结合为与会师生提供新的创新研发思路。随后，李连忠教授与师生进行了深入交流。

讲座最后，副院长张礼杰对本次讲座内容进行了总结，并感谢李连忠教授的精彩讲授。本次讲座不仅为我院师生提供更广阔的学术研究视野和思维方式，丰富师生学术素养，也对师生未来研究方向提供了思路上的启发。

Dr. Li has been the Chair Professor of Future Electronics at the University of Hong Kong (HKU) since 2021 with the research focus on solving grand challenges in using low-dimensional materials for scaled electronics and as backend transistors for monolithic 3D integration.

Prior to joining HKU, Li was a Director of Corporate Research in Taiwan Semiconductor Manufacturing Company (TSMC) from 2017 to 2020. He was working on developing key technologies of integrating low-dimensional materials with current micro/nanoelectronics.

Dr. Li worked as a Professor at KAUST from 2014-2017, a research fellow at Academia Sinica in Taiwan (2010-2014), an Assistant Professor at Nanyang Technological University (NTU) Singapore (2006-2009) respectively.  He received his PhD in condensed matter physics at Oxford University, and MSc/BSc degrees in Chemistry at National Taiwan University. He is a highly cited scholar since 2018.